Gallium arsenide polishing paste

Our company has a mature product layout and technology accumulation in the field of grinding and polishing of sapphire substrate materials, silicon carbide substrate materials, and single crystal silicon substrate materials, which can achieve rapid flattening of various substrate materials, while meeting customers’ basic surface requirements such as TTV, LTV, and Warp, improving processing efficiency, extending service life, and reducing costs and increasing efficiency through material and process improvements.

Introduction:

This gallium arsenide (GaAs) polishing paste is a precision chemical-mechanical planarization (CMP) material designed for ultra-smooth surface finishing of GaAs wafers. Formulated with optimized abrasive particles and chemical activators, it achieves atomic-level surface perfection while maintaining strict stoichiometric control. The paste effectively minimizes surface defects and subsurface damage, critical for preserving GaAs’ unique electronic and optoelectronic properties.

Application:

Essential for compound semiconductor manufacturing, the paste is widely used in producing high-frequency devices, laser diodes, and photovoltaic cells. It enables precision processing of GaAs substrates for 5G/6G communications, satellite technologies, and advanced photonic applications. The formulation meets stringent requirements for both industrial mass production and research-scale applications in microelectronics and optoelectronics industries.