Diamond abrasive solution for silicon carbide substrate

Our company covers a wide range of metal polishing fields, and can provide mirror-level and super-mirror-level polishing solutions for various metal materials such as bowl alloys, copper, aluminum, and stainless steel. The product system has various forms and properties such as polishing liquid, polishing wax, and grinding paste, which are used in multiple fields such as mobile phone frames, copper-clad boards, decorative logos, structural appearance, etc., and can meet different usage scenarios such as polishing discs, five-axis machines, polishing wheels, and roll-to-roll.

Introduction:

This diamond abrasive solution is a high-performance suspension specifically formulated for precision grinding and polishing of silicon carbide (SiC) substrates. The solution contains uniformly dispersed diamond particles with precisely controlled particle sizes, combined with stabilizing agents to ensure consistent abrasive performance. It delivers efficient material removal while minimizing surface and subsurface damage, achieving superior flatness and surface quality required for advanced semiconductor applications.

Application:

The solution is widely used in power electronics, RF devices, and LED manufacturing for processing SiC wafers. It is essential for producing high-efficiency power modules, electric vehicle components, and next-generation communication devices. The formulation supports both single-wafer and batch processing in industrial-scale production environments, meeting the stringent requirements of wide-bandgap semiconductor fabrication.